Latest News In AI Chips – Silicon Carbide Boosts Efficiency In AI Infra Revolution
Silicon carbide is taking center stage in the AI infrastructure race. Coherent Corp. has unveiled a 300mm silicon carbide (SiC) platform designed to meet the surging thermal efficiency demands of AI-driven datacenters. Building on its 200mm SiC expertise, the company’s move to larger-diameter wafers aims to unlock higher power density, faster switching, and superior thermal management—capabilities that are increasingly critical as AI workloads scale.
Coherent’s 300mm SiC: Why It Matters
AI accelerators and high-performance servers are pushing datacenter power envelopes to new heights, making thermal efficiency a first-order design challenge. Coherent’s 300mm SiC platform targets that challenge directly. By transitioning to larger wafers, the platform can improve energy efficiency and heat dissipation while enabling higher-performance power electronics. The payoff isn’t limited to hyperscale datacenters: the same advances stand to benefit AR/VR devices, renewable energy systems, and broader power applications where efficiency and thermal margins are crucial.
The announcement underscores how SiC is evolving from a niche power semiconductor into a foundational technology for AI-era infrastructure. Better thermal characteristics and switching behavior can translate into more compact power modules, lower cooling overhead, and improved system reliability—key levers for scaling AI compute economically and sustainably.
Market Snapshot
In broader market action, Rigetti Computing rallied 15.4% to close at $30.06, while Intel slipped 7.4% to finish at $40.50. Intel’s ongoing strategic overhaul to capture AI-driven growth remains a major storyline and will be closely watched by investors and industry watchers alike.
Best AI Chip Stocks: Weekly Highlights
- NVIDIA (NVDA) closed at $183.38, up 2.1%. The company expanded AI partnerships with Upwind and Aidoc, bolstering infrastructure security and scaling deployment of medical imaging AI models.
- Advanced Micro Devices (AMD) finished at $215.98, down 0.7%. AMD deepened collaborations with HPE and Vultr to advance scalable AI infrastructure and supercomputing, highlighting new deployments and product updates.
- Micron Technology (MU) closed at $226.65, down 3.2%. Micron said it will exit the Crucial consumer business to refocus on core enterprise and commercial segments.
The Bigger Picture
As AI adoption accelerates, the hidden bottleneck is increasingly on the power and cooling side—not just compute throughput. That’s where SiC comes in. With better thermal properties than traditional silicon for high-voltage, high-temperature environments, SiC-based platforms can reduce losses, enable faster switching, and shrink system footprints. Coherent’s 300mm advance signals an industry push to scale these benefits, potentially lowering total cost of ownership for AI datacenters and enhancing efficiency at the edge.
The industry’s near-term priorities are clear: improve power conversion efficiency, manage thermals proactively, and deploy architectures that support rapid scaling without runaway energy costs. SiC innovations—combined with smarter power topologies, advanced packaging, and tight integration with accelerators—are fast becoming a strategic differentiator for AI infrastructure.
Editor’s Note
This coverage is for informational purposes only and reflects analysis of recent announcements and market data. It is not investment advice and does not consider your individual objectives or financial situation. Figures and developments referenced are based on the latest reported market close and company communications at the time of writing and may not include subsequent updates.
